{"id":2,"date":"2016-06-23T10:38:47","date_gmt":"2016-06-23T08:38:47","guid":{"rendered":"http:\/\/http:\/\/wp.adam-research.de\/?page_id=2"},"modified":"2025-03-17T12:50:24","modified_gmt":"2025-03-17T11:50:24","slug":"software","status":"publish","type":"page","link":"https:\/\/www.adam-research.de\/en\/software\/","title":{"rendered":"TRM"},"content":{"rendered":"

TRM<\/strong><\/span> is PDN analysis<\/strong> plus<\/em> Thermal Analysis<\/strong> - for any<\/em> PCB designer and engineer.<\/strong><\/p>\n

TRM<\/strong><\/span> software by ADAM Research is a special tool of engineering analysis which takes care about the needs and necessary details of PCB simulations.<\/strong><\/em><\/p>\n

Trace temperatures<\/strong> due to Joule heating (current carrying capacity) and board heating by components<\/strong> are calculated from physical principles. Because the user is guided through the software in a way a software assistant does, it is perfectly suited for use by a PCB designer<\/strong> or an electric engineer<\/strong>.<\/p>\n

Neither knowledge about numerical methods or gridding techniques is required nor a need to be coupled to a high-price electronic CAD System.<\/em>
\n\"OptionsTRM <\/b> can handle single layers, multilayers<\/strong>, SMD<\/strong> heat sources, embedded components<\/strong>, pins<\/strong>, inlays<\/strong>, busbars, copper thickness, adhesives,<\/strong> plugged and unplugged, blind and burried vias<\/strong>, heat sinks<\/strong>, chassis parts and bolts<\/strong>. Requirement: the PCB should be more or less geometrically flat. Components, heat sinks, cold plates and cables are characterized by thermal parameters.<\/p>\n

For a calculation of current-carrying capacity and temperature the following input data are needed:<\/p>\n