A STUDY ABOUT EVAL-LTM4703-AZ EVALUATION BOARD WITH TRM <\/strong> A STUDY ABOUT EVAL-LTM4703-AZ EVALUATION BOARD WITH TRM<\/a><\/p>\n Switching regulators are essential in modern power electronics. However, their performance is closely tied to thermal management, as power dissipation during switching operations can lead to significant temperature rise, affecting efficiency, reliability, and longevity.<\/p>\n This study focuses on the EVAL-LTM4703-AZ evaluation board by Analog Devices<\/a>, a high-efficiency, dual-channel \u03bcModule\u00ae regulator. The compact design and high-power density of this regulator make it an ideal candidate for analyzing thermal challenges in switching regulators. By bridging theoretical modeling, experimental validation, and simulation, this work comprehensively assesses temperature rise and associated phenomena.<\/p>\n Methods to calculate power losses, measure thermal profiles under operational stress, and simulate heat distribution using TRM<\/strong><\/span> software are presented. Additionally, voltage drops across parasitic resistances are quantified, highlighting their impact on system efficiency. The findings aim to aid engineers in optimizing thermal design in high-current switching regulators, balancing power density with thermal reliability<\/p>\n PCB Design Guide to Via and Trace Currents and Temperatures<\/strong><\/span> Doug Brooks<\/em> has revised his book and it is now available from Artech House. https:\/\/us.artechhouse.com\/PCB-Design-Guide-to-Via-and-Trace-Currents-and-Temperatures-P2191.aspx<\/a><\/p>\n PCB Trace and Via Currents and Temperatures: The Complete Analysis (2nd edition)<\/span> b<\/span>y Douglas G. Brooks<\/em> PhD (Author), <\/span> <\/span> <\/span> Dr. Johannes Adam<\/em> (Contributor)<\/span> <\/span> <\/span><\/p>\n<\/div>\n<\/div>\n
\nUlisses Castro , Johannes Adam<\/em><\/span><\/span><\/p>\n
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\nby Douglas G. Brooks<\/em> PhD (Author), <\/span> <\/span> <\/span> Dr. Johannes Adam<\/em> (Contributor)<\/span><\/span><\/span><\/span><\/p>\n
\nExplores how hot traces and vias will be and what board, circuit, design, and environmental parameters are the most important;
\n\u25cf He is using TRM<\/strong><\/span> and outlines the process of model building.
\n\u25cf Covers PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces;
\n\u25cf Details the IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations;
\n\u25cf Presents sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients;
\n\u25cf Explores via temperatures and what determines them, along with fusing issues and whether we can predict the fusing time of traces;
\n\u25cf Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure.<\/p>\n![\"Doug](\"https:\/\/us.artechhouse.com\/Assets\/ProductImages\/8605_t.jpg\")
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