{"id":1673,"date":"2020-11-28T09:53:55","date_gmt":"2020-11-28T08:53:55","guid":{"rendered":"https:\/\/www.adam-research.de\/?p=1673"},"modified":"2020-11-28T10:38:59","modified_gmt":"2020-11-28T09:38:59","slug":"junction-ambient","status":"publish","type":"post","link":"https:\/\/www.adam-research.de\/en\/2020\/11\/junction-ambient\/","title":{"rendered":"Junction-Ambient controlled by the Layout"},"content":{"rendered":"<p>The thermal resistance \"Junction-Ambient\" \u0398JA or R\u0398JA links a temperature node inside the silicon die (Junction) with the surrounding air (Ambient). \"Ambient\" includes everything around the component, from the pad to the air - i.e. especially the special topology of the PCB. Therefore R\u0398JA cannot be used to predict the temperature for a specific board. Here are some screenshots from <em><a href=\"http:\/\/www.adam-research.de\/pdfs\/design007-sept2020-1_extract_TRM.pdf\" target=\"_blank\" rel=\"noopener noreferrer\">Don't believe the data sheets<\/a>. <\/em><a href=\"http:\/\/iconnect007.uberflip.com\/i\/1285883-design007-sept2020\" target=\"_blank\" rel=\"noopener noreferrer\">Design007 Magazine (September 2020)<\/a>.They show that the heat spreading on a real PCB is not perfect and that it was certainly different on the test PCB of the data sheet.<\/p>\n<ul>\n<li>This Arduino board is 2-layer. The parallel running tracks can improve and impede the heat spreading.<\/li>\n<\/ul>\n<figure id=\"attachment_1679\" aria-describedby=\"caption-attachment-1679\" style=\"width: 952px\" class=\"wp-caption alignnone\"><img decoding=\"async\" loading=\"lazy\" class=\"wp-image-1679 size-full\" src=\"https:\/\/www.adam-research.de\/wp-content\/uploads\/2020\/11\/Arduino_top.png\" alt=\"Simulated thermal image of top Layer of Arduino Board\" width=\"952\" height=\"511\" srcset=\"https:\/\/www.adam-research.de\/wp-content\/uploads\/2020\/11\/Arduino_top.png 952w, https:\/\/www.adam-research.de\/wp-content\/uploads\/2020\/11\/Arduino_top-300x161.png 300w, https:\/\/www.adam-research.de\/wp-content\/uploads\/2020\/11\/Arduino_top-768x412.png 768w\" sizes=\"(max-width: 952px) 100vw, 952px\" \/><figcaption id=\"caption-attachment-1679\" class=\"wp-caption-text\">Top Layer of an Arduino Board calculated with TRM3<\/figcaption><\/figure>\n<p>&nbsp;<\/p>\n<ul>\n<li style=\"text-align: left;\">Even with multilayer boards with solid inner layers, the layout can dominate the heat spreading. In this evaluation board we see that the thermal vias are in fact useless, because they are just as warm as the component, so no heat\u00a0\u00a0\u00a0 is removed.<\/li>\n<\/ul>\n<p><figure id=\"attachment_1681\" aria-describedby=\"caption-attachment-1681\" style=\"width: 886px\" class=\"wp-caption alignnone\"><img decoding=\"async\" loading=\"lazy\" class=\"wp-image-1681 size-full\" src=\"https:\/\/www.adam-research.de\/wp-content\/uploads\/2020\/11\/EVB-USB580X_A-Modell_bot.png\" alt=\"PCB Simulation of Microchip Eval Board EVB-USB580X\" width=\"886\" height=\"505\" srcset=\"https:\/\/www.adam-research.de\/wp-content\/uploads\/2020\/11\/EVB-USB580X_A-Modell_bot.png 886w, https:\/\/www.adam-research.de\/wp-content\/uploads\/2020\/11\/EVB-USB580X_A-Modell_bot-300x171.png 300w, https:\/\/www.adam-research.de\/wp-content\/uploads\/2020\/11\/EVB-USB580X_A-Modell_bot-768x438.png 768w\" sizes=\"(max-width: 886px) 100vw, 886px\" \/><figcaption id=\"caption-attachment-1681\" class=\"wp-caption-text\">Bottom Layer of MicroChip Eval Board EVB-USB580X calculated with TRM3<\/figcaption><\/figure><\/p>","protected":false},"excerpt":{"rendered":"<p>The thermal resistance \"Junction-Ambient\" \u0398JA or R\u0398JA links a temperature node inside the silicon die (Junction) with the surrounding air (Ambient). \"Ambient\" includes everything around the component, from the pad to the air - i.e. especially the special topology of the PCB. Therefore R\u0398JA cannot be used to predict the temperature for a specific board. <a href=\"https:\/\/www.adam-research.de\/en\/2020\/11\/junction-ambient\/\" class=\"more-link\">...continue reading<span class=\"screen-reader-text\"> \"Junction-Ambient controlled by the Layout\"<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[1],"tags":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v20.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Junction-Ambient controlled by the Layout - ADAM Research<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.adam-research.de\/en\/2020\/11\/junction-ambient\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"[:de]Junction-Ambient und Layout [:en]Junction-Ambient controlled by the Layout[:fr]Junction-Ambient[:] - ADAM Research\" \/>\n<meta property=\"og:description\" content=\"The thermal resistance &quot;Junction-Ambient&quot; \u0398JA or R\u0398JA links a temperature node inside the silicon die (Junction) with the surrounding air (Ambient). &quot;Ambient&quot; includes everything around the component, from the pad to the air - i.e. especially the special topology of the PCB. 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