{"id":556,"date":"2017-02-03T15:12:07","date_gmt":"2017-02-03T14:12:07","guid":{"rendered":"http:\/\/www.adam-research.de\/?p=556"},"modified":"2017-08-19T09:18:27","modified_gmt":"2017-08-19T07:18:27","slug":"english-numerical-soldering","status":"publish","type":"post","link":"https:\/\/www.adam-research.de\/en\/2017\/02\/english-numerical-soldering\/","title":{"rendered":"Solder by Numbers"},"content":{"rendered":"

Accidentally this week and last week I did some non-standard thermal simulations with through-hole pins by imitating hot solder solder wave underneath the PCB. Of course a mere thermal simualtion can only look at heat spreading in detail but cannot cover metallurgical or fabrication aspects. Nevertheless, the results gave a correct agreement of positions of the problematic pins (and those without problems) compared to the solder wave result<\/em>. Among other effects it showed that local copper around a solder pin can help heat to flow toward <\/em>the pin rather than flowing away<\/em> from it. But all that depends on details of the layout in the bottom layer and maybe in other layers as well, the mass of the component, how the flux is dispensed and many more influencing parameters. A numerical investigation can help to reduce the number of prototypes.<\/p>","protected":false},"excerpt":{"rendered":"

Accidentally this week and last week I did some non-standard thermal simulations with through-hole pins by imitating hot solder solder wave underneath the PCB. Of course a mere thermal simualtion can only look at heat spreading in detail but cannot cover metallurgical or fabrication aspects. Nevertheless, the results gave a correct agreement of positions of ...continue reading \"Solder by Numbers\"<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[1],"tags":[5,6],"yoast_head":"\nSolder by Numbers - ADAM Research<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.adam-research.de\/es\/2017\/02\/english-numerical-soldering\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"[:de]L\u00f6ten mit Zahlen[:en]Solder by Numbers[:] - ADAM Research\" \/>\n<meta property=\"og:description\" content=\"Accidentally this week and last week I did some non-standard thermal simulations with through-hole pins by imitating hot solder solder wave underneath the PCB. 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Of course a mere thermal simualtion can only look at heat spreading in detail but cannot cover metallurgical or fabrication aspects. Nevertheless, the results gave a correct agreement of positions of ...continue reading \"Solder by Numbers\"","og_url":"https:\/\/www.adam-research.de\/es\/2017\/02\/english-numerical-soldering\/","og_site_name":"ADAM Research","article_published_time":"2017-02-03T14:12:07+00:00","article_modified_time":"2017-08-19T07:18:27+00:00","author":"admin","twitter_card":"summary_large_image","twitter_misc":{"Written by":"admin","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.adam-research.de\/es\/2017\/02\/english-numerical-soldering\/","url":"https:\/\/www.adam-research.de\/es\/2017\/02\/english-numerical-soldering\/","name":"[:de]L\u00f6ten mit Zahlen[:en]Solder by Numbers[:] - ADAM Research","isPartOf":{"@id":"https:\/\/www.adam-research.de\/#website"},"datePublished":"2017-02-03T14:12:07+00:00","dateModified":"2017-08-19T07:18:27+00:00","author":{"@id":"https:\/\/www.adam-research.de\/#\/schema\/person\/d5ddf9e4cf9145db3652c1d2484ffcb2"},"breadcrumb":{"@id":"https:\/\/www.adam-research.de\/es\/2017\/02\/english-numerical-soldering\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.adam-research.de\/es\/2017\/02\/english-numerical-soldering\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.adam-research.de\/es\/2017\/02\/english-numerical-soldering\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Startseite","item":"https:\/\/www.adam-research.de\/"},{"@type":"ListItem","position":2,"name":"L\u00f6ten mit Zahlen"}]},{"@type":"WebSite","@id":"https:\/\/www.adam-research.de\/#website","url":"https:\/\/www.adam-research.de\/","name":"ADAM Research","description":"Thermal Risk Management in Electronics","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.adam-research.de\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/www.adam-research.de\/#\/schema\/person\/d5ddf9e4cf9145db3652c1d2484ffcb2","name":"admin","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.adam-research.de\/#\/schema\/person\/image\/","url":"https:\/\/secure.gravatar.com\/avatar\/79e65456f240af1f00e74907fc64e88c?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/79e65456f240af1f00e74907fc64e88c?s=96&d=mm&r=g","caption":"admin"},"url":"https:\/\/www.adam-research.de\/en\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.adam-research.de\/en\/wp-json\/wp\/v2\/posts\/556"}],"collection":[{"href":"https:\/\/www.adam-research.de\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.adam-research.de\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.adam-research.de\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.adam-research.de\/en\/wp-json\/wp\/v2\/comments?post=556"}],"version-history":[{"count":7,"href":"https:\/\/www.adam-research.de\/en\/wp-json\/wp\/v2\/posts\/556\/revisions"}],"predecessor-version":[{"id":653,"href":"https:\/\/www.adam-research.de\/en\/wp-json\/wp\/v2\/posts\/556\/revisions\/653"}],"wp:attachment":[{"href":"https:\/\/www.adam-research.de\/en\/wp-json\/wp\/v2\/media?parent=556"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.adam-research.de\/en\/wp-json\/wp\/v2\/categories?post=556"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.adam-research.de\/en\/wp-json\/wp\/v2\/tags?post=556"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}