{"id":304,"date":"2016-12-08T12:22:14","date_gmt":"2016-12-08T11:22:14","guid":{"rendered":"http:\/\/wp.adam-research.de\/?page_id=304"},"modified":"2025-05-29T08:30:05","modified_gmt":"2025-05-29T06:30:05","slug":"buch","status":"publish","type":"page","link":"https:\/\/www.adam-research.de\/es\/dokumente\/buch\/","title":{"rendered":"Libros"},"content":{"rendered":"

PCB Design Guide to Via and Trace Currents and Temperatures<\/strong><\/span>
\nby Douglas G. Brooks<\/em> PhD (Author), <\/span> <\/span> <\/span> Dr. Johannes Adam<\/em> (Contributor)<\/span><\/span><\/span><\/span><\/p>\n

Doug Brooks<\/em> has revised his book and it is now available from Artech House.
\nExplores how hot traces and vias will be and what board, circuit, design, and environmental parameters are the most important;
\n\u25cf He is using TRM<\/strong><\/span> and outlines the process of model building.
\n\u25cf Covers PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces;
\n\u25cf Details the IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations;
\n\u25cf Presents sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients;
\n\u25cf Explores via temperatures and what determines them, along with fusing issues and whether we can predict the fusing time of traces;
\n\u25cf Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure.<\/p>\n

https:\/\/us.artechhouse.com\/PCB-Design-Guide-to-Via-and-Trace-Currents-and-Temperatures-P2191.aspx<\/a><\/p>\n

\n
\n

\"Doug<\/p>\n<\/div>\n<\/div>\n

<\/p>","protected":false},"excerpt":{"rendered":"

PCB Design Guide to Via and Trace Currents and Temperatures by Douglas G. Brooks PhD (Author), Dr. Johannes Adam (Contributor) Doug Brooks has revised his book and it is now available from Artech House. Explores how hot traces and vias will be and what board, circuit, design, and environmental parameters are the most important; \u25cf ...contin\u00faa leyendo \"Libros\"<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":36,"menu_order":4,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"\nLibros - ADAM Research<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.adam-research.de\/dokumente\/buch\/\" \/>\n<meta property=\"og:locale\" content=\"es_ES\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"[:de]B\u00fccher[:en]Books[:fr]Livres[:es]Libros[:] - ADAM Research\" \/>\n<meta property=\"og:description\" content=\"PCB Design Guide to Via and Trace Currents and Temperatures by Douglas G. Brooks PhD (Author), Dr. Johannes Adam (Contributor) Doug Brooks has revised his book and it is now available from Artech House. Explores how hot traces and vias will be and what board, circuit, design, and environmental parameters are the most important; \u25cf ...contin\u00faa leyendo "Libros"\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.adam-research.de\/dokumente\/buch\/\" \/>\n<meta property=\"og:site_name\" content=\"ADAM Research\" \/>\n<meta property=\"article:modified_time\" content=\"2025-05-29T06:30:05+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/vogel-fachbuch.de\/media\/image\/7a\/5a\/f0\/3462hAhw5wWCZGPfs.jpg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Tiempo de lectura\" \/>\n\t<meta name=\"twitter:data1\" content=\"3 minutos\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.adam-research.de\/dokumente\/buch\/\",\"url\":\"https:\/\/www.adam-research.de\/dokumente\/buch\/\",\"name\":\"[:de]B\u00fccher[:en]Books[:fr]Livres[:es]Libros[:] - ADAM Research\",\"isPartOf\":{\"@id\":\"https:\/\/www.adam-research.de\/#website\"},\"datePublished\":\"2016-12-08T11:22:14+00:00\",\"dateModified\":\"2025-05-29T06:30:05+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/www.adam-research.de\/dokumente\/buch\/#breadcrumb\"},\"inLanguage\":\"es\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.adam-research.de\/dokumente\/buch\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.adam-research.de\/dokumente\/buch\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Startseite\",\"item\":\"https:\/\/www.adam-research.de\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Dokumente\",\"item\":\"https:\/\/www.adam-research.de\/dokumente\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"B\u00fccher\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.adam-research.de\/#website\",\"url\":\"https:\/\/www.adam-research.de\/\",\"name\":\"ADAM Research\",\"description\":\"Thermal Risk Management in Electronics\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.adam-research.de\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"es\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"[:de]B\u00fccher[:en]Books[:fr]Livres[:es]Libros[:] - ADAM Research","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.adam-research.de\/dokumente\/buch\/","og_locale":"es_ES","og_type":"article","og_title":"[:de]B\u00fccher[:en]Books[:fr]Livres[:es]Libros[:] - ADAM Research","og_description":"PCB Design Guide to Via and Trace Currents and Temperatures by Douglas G. 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