{"id":20,"date":"2016-11-21T15:26:15","date_gmt":"2016-11-21T14:26:15","guid":{"rendered":"http:\/\/wp.adam-research.de\/?page_id=20"},"modified":"2025-09-29T15:00:08","modified_gmt":"2025-09-29T13:00:08","slug":"leiterplatte","status":"publish","type":"page","link":"https:\/\/www.adam-research.de\/fr\/leiterplatte\/","title":{"rendered":"Composants"},"content":{"rendered":"<p><strong><b>La perte de puissance n'est pas tout<\/b><\/strong><br \/>\nLa temp\u00e9rature \u00e0 laquelle le composant entre dans l'assemblage ne d\u00e9pend pas seulement de sa puissance dissip\u00e9e (Watt). La surface de plancher (empreinte des pieds) et la dissipation de chaleur par le cuivre et FR4 dans le LP jouent \u00e9galement un r\u00f4le important dans la dissipation de chaleur. L'estimation de la temp\u00e9rature des composants par calcul manuel n'est possible que pour des cas particuliers acad\u00e9miques si la structure de la couche et le profil de conductivit\u00e9 sont extr\u00eamement moyens. Cependant, si vous voulez obtenir de meilleurs r\u00e9sultats avec votre <a href=\"https:\/\/www.adam-research.de\/pdfs\/TRM_CaseStudy1.pdf\" target=\"_blank\" rel=\"noopener noreferrer\">trace<\/a>, vous devez calculer les traces, les surfaces de cuivre et les trous.  <\/p>\n<p><a href=\"https:\/\/www.adam-research.de\/galerie\/images\/TRM_Intersil_comparison.jpg\"><img decoding=\"async\" loading=\"lazy\" class=\"size-medium wp-image-81 aligncenter\" src=\"http:\/\/wp.adam-research.de\/wp-content\/uploads\/2016\/11\/TRM_Intersil_comparison-300x169.jpg\" alt=\"trm_intersil_comparison\" width=\"300\" height=\"169\" srcset=\"https:\/\/www.adam-research.de\/wp-content\/uploads\/2016\/11\/TRM_Intersil_comparison-300x169.jpg 300w, https:\/\/www.adam-research.de\/wp-content\/uploads\/2016\/11\/TRM_Intersil_comparison.jpg 605w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/a><b><\/b><\/p>\n<p><strong><b>Les d\u00e9tails devraient (doivent) \u00eatre pris en compte<\/b><\/strong><br \/>\nLe logiciel TRM (Thermal Risk Management) permet d'effectuer des calculs de temp\u00e9rature tridimensionnels d\u00e9taill\u00e9s pour les circuits imprim\u00e9s. Par exemple, le mod\u00e8le de base PCB est cr\u00e9\u00e9 \u00e0 partir de <strong>Gerber<\/strong> ou d'esquisses, perc\u00e9 avec des fichiers de per\u00e7age et l'assemblage \u00e0 partir des fichiers IDF est ajout\u00e9. D'autres caract\u00e9ristiques de la technique de montage et de raccordement et la description des composants peuvent \u00eatre consid\u00e9r\u00e9es. La r\u00e9solution x-y est g\u00e9n\u00e9ralement comprise entre 0,1 mm et 0,2 mm. Par les diff\u00e9rences des variantes on peut voir quelle mesure est bien comprise, mais finalement inefficace (et peut-\u00eatre co\u00fbteuse). Le chauffage actuel (chauffage en joule) des pistes conductrices peut \u00eatre pris en compte simultan\u00e9ment avec les composants.<\/p>\n<p>Traduit avec www.DeepL.com\/Translator<\/p>","protected":false},"excerpt":{"rendered":"<p>La perte de puissance n'est pas tout La temp\u00e9rature \u00e0 laquelle le composant entre dans l'assemblage ne d\u00e9pend pas seulement de sa puissance dissip\u00e9e (Watt). La surface de plancher (empreinte des pieds) et la dissipation de chaleur par le cuivre et FR4 dans le LP jouent \u00e9galement un r\u00f4le important dans la dissipation de chaleur. <a href=\"https:\/\/www.adam-research.de\/fr\/leiterplatte\/\" class=\"more-link\">...continue reading<span class=\"screen-reader-text\"> \"Composants\"<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":2,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v20.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Composants - ADAM Research<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.adam-research.de\/leiterplatte\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"[:de]Bauteile[:en]Components[:fr]Composants[:es]Componentes[:] - ADAM Research\" \/>\n<meta property=\"og:description\" content=\"La perte de puissance n&#039;est pas tout La temp\u00e9rature \u00e0 laquelle le composant entre dans l&#039;assemblage ne d\u00e9pend pas seulement de sa puissance dissip\u00e9e (Watt). 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