{"id":382,"date":"2016-12-19T11:19:22","date_gmt":"2016-12-19T10:19:22","guid":{"rendered":"http:\/\/www.adam-research.de\/?page_id=382"},"modified":"2019-10-31T10:52:45","modified_gmt":"2019-10-31T09:52:45","slug":"dokumentarchiv","status":"publish","type":"page","link":"https:\/\/www.adam-research.de\/fr\/dokumente\/dokumentarchiv\/","title":{"rendered":"Archive"},"content":{"rendered":"

Cher lecteur, <\/b>vous \u00eates le bienvenu pour prendre des informations pour votre travail professionnel. Soyez juste et respectez la pratique de la citation scientifique. Merci beaucoup!<\/p>\n

1. Courant et temp\u00e9rature <\/strong><\/span><\/p>\n

D. Brooks: PCB Trace and Via Currents and Temperatures: The Complete Analysis<\/i><\/span>
\nFinally! For the first time, here is a complete, thorough analysis of the relationships between PCB trace (and via) currents and trace temperatures.
\nAll in one place! Brooks has been looking at these relationships since the mid '90s.
\nAnd he has assembled 20-plus years of knowledge into these pages.
\nStarting with a historical background, this book covers ...
\nSee more ...<\/a> <\/i><\/p>\n

Johannes Adam (ADAM Research) and Douglas Brooks (UltraCAD Inc.)
\nElectric Current and VIA Temperature - Experiment vs. Simulation.<\/i> <\/span>Case Study No. 2 (2016)
\nTo Download<\/a> <\/i><\/p>\n

Douglas G. Brooks and Johannes Adam
\nHow AC Currents Affect PCB Trace Temperatures. Part 1<\/span><\/em>. PCD&F, September 2016.
\nto Download<\/a><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.)
\nHow AC Currents affect PCB Trace Temperatures. Part 2<\/span>.<\/em> Printed Circuit Design and Fabrication (2016, page 24)
\nTo Download<\/a><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.) and Dr. Johannes Adam (ADAM Research)
\nVia Currents and Temperatures<\/span>.<\/i> Web paper Ultracad Design Inc. (2015)
\nTo Download<\/a><\/i><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.) and Dr. Johannes Adam (ADAM Research)
\nCurrent Densities in Vias.<\/i> <\/span>Web paper Ultracad Design Inc. (2015)
\nTo Download<\/a> <\/i><\/p>\n

Dr. Johannes Adam (ADAM Research) and Douglas Brooks, Ph.D. (Ultracad Inc.)
\nIn Search for Preece and Onderdonk<\/i>.<\/span> Web paper Ultracad Design Inc. (2015)
\nTo Download<\/a> <\/i><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.)
\nYour Traces have Hot Spots<\/i>.<\/span> The PCB Design Magazine (2016)
\nTo Download<\/a> <\/i><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.) and Dr. Johannes Adam (ADAM Research)
\nFusing Currents in Traces<\/i>.<\/span> Web paper Ultracad Design Inc. (2015)
\nTo Download<\/a> <\/i><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.)
\nEmpirical Results of Fusing Tests<\/i><\/span>. Printed Circuit Design and Fabrication (2015)
\nTo Download<\/a> <\/i><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.) and Dr. Johannes Adam (ADAM Research)
\nThe Dynamics of PCB Trace Heating and Cooling, and a Call to Action<\/span><\/i>.<\/span> PCD&F July 2016
\nTo Download<\/a> <\/i><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.) and Dr. Johannes Adam (ADAM Research)
\nTrace Current\/Temperature Relationships.<\/i> <\/span>PCD&F June 2015 Vol. 32 No.6, pp. 22-27
\nTo Download<\/a> <\/i><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.) and Dr. Johannes Adam (ADAM Research)
\nTrace Currents and Temperatures Revisited.<\/i> <\/span>Web paper Ultracad Design Inc. (2015)
\nTo Download<\/a> <\/i>
\n <\/i><\/p>\n

Dr. Johannes Adam (ADAM Research)
\nVirtuelle Thermographie von Leiterplatten und Leiterbahnen. II. Strombelastung<\/em><\/span>. PLUS 4 (2013) S. 734-739
\nScan zum download<\/a> <\/i><\/p>\n

Dr. Johannes Adam (ADAM Research) und Marc Mitchell (Robert Bosch GmbH)
\nStrombelastbarkeit von Layouts \u2013 Design, Simulation und Messung<\/span> <\/i>
\nArtikel als pdf zum download<\/a> <\/i>
\nElektronische Baugruppen und Leiterplatten EBL (2012). 6. DVS\/GMM-Tagung Fellbach Tagungsband<\/a><\/i>
\n <\/i><\/p>\n

Dr. Johannes Adam, ADAM Research
\nThermal Management of Boards and Current-Carrying Capacity. <\/span><\/em>Bodo's Power System, Issue October 2011, pp. 40
\ndownload<\/a><\/i><\/p>\n

Dr. Johannes Adam, Flomerics Limited
\nNeues von der Strombelastbarkeit von Leiterbahnen. <\/em><\/span>DVS\/GMM-Fachtagung \"Elektronische Baugruppen - Aufbau- und Fertigungstechnik. Die Trends von heute - die Chancen von morgen\" Fellbach 4.\/5. Februar (2004). GMM-Fachbericht 44.
\npdf zum download<\/a> <\/i><\/p>\n

Dr. Johannes Adam, Flomerics Limited
\nNew Correlations Between Electrical Current and Temperature Rise in PCB Traces. <\/em><\/span>Proc. 20th IEEE SEMI-THERM Symposium, 292-299 (2004)
\nhttp:\/\/web.ics.purdue.edu\/~gblack\/Trace%20Temp%20Study.pdf<\/a><\/p>\n

Dr. Johannes Adam, Flomerics Limited
\nStrombelastbarkeit von Leiterbahnen Teil 1: Grundlagen.<\/em> <\/span>PLUS 4 Heft 10, 1669-1673 (2002)
\nEine PDF-Datei erhalten Sie auf Anfrage.<\/i><\/a><\/p>\n

Dr. Johannes Adam, Flomerics Limited
\nStrombelastbarkeit von Leiterbahnen Teil 2:IPC-Richtline IPC-D-275 Mythos und Wirklichkeit.<\/span><\/em> PLUS 4 Heft 11, 1817-1823 (2002)
\nEine PDF-Datei erhalten Sie auf Anfrage.<\/i><\/a><\/p>\n

Johannes Adam, Flomerics Limited
\nStrombelastbarkeit von Leiterbahnen Teil 3: Weitere Diagramme f\u00fcr Multilayer und Umrechnungsregeln. <\/em><\/span>PLUS 6 Heft 4, 513-518 (2004)
\nEine pdf-Datei erhalten Sie auf Anfrage.<\/i><\/a><\/p>\n

Johannes Adam, Flomerics Limited
\nIPC-2152 : Neue Richtwerte f\u00fcr die Strombelastbarkeit von Leiterz\u00fcgen in Leiterplatten.<\/span> Konferenzband 11. FED-Konferenz Ludwigsburg, 11-331 (2003)<\/i>
\n<\/i><\/p>\n

2. Composants et temp\u00e9rature<\/strong><\/span>
\n<\/i><\/i><\/p>\n

N.K. Sardana, S.P. Busam, L. Biswal (Robert Bosch Engineering and Business Solution Pvt. Ltd.)
\nSimulation Driven Design Optimization for Reduction of Temperature on a High Current Density PCB<\/i><\/span>. International NAFEMS Conference on Engineering Analysis,
\nModeling, Simulation and 3D-Printing (2016)
\nTo Download<\/a> <\/i>
\n <\/i><\/p>\n

Johannes Adam (ADAM Research)
\nKomplette Temperaturberechung bei der Leiterplattenk\u00fchlung. <\/i><\/span>Elektronik Praxis Nr.2 (2016)
\nTo Download<\/a> <\/i><\/p>\n

Dr. Johannes Adam (ADAM Research)
\nVirtuelle Thermographie von Leiterplatten und Leiterbahnen. I. Hotspots durch Bauteile. <\/em><\/span>PLUS 3 (2013) S. 471-479
\nscan zum download<\/a> <\/i><\/p>\n

Dr. Johannes Adam, ADAM-Research
\nDie Leiterplatte als K\u00fchlk\u00f6rper nutzen.<\/em><\/span> ElektronikPraxis Heft2 S. 46-48 (2010)
\nhttp:\/\/www.elektronikpraxis.vogel.de\/waermemanagement\/articles\/246064\/<\/a><\/i><\/p>\n

Dr. Johannes Adam, Mentor Graphics
\nDie Leiterplatte als K\u00fchlk\u00f6rper. <\/span><\/em>Haus der Technik, 3. Tagung Elektronikk\u00fchlung, M\u00fcnchen (2009).
\nArtikel als pdf zum download<\/a> <\/i><\/p>\n

Dr. Johannes Adam, Flomerics Limited und Dr. Max Poech, Fraunhofer Institut f. Siliziumtechnologie Itzehoe
\nSimulation der Leiterplatte im Reflow-Ofen. <\/span><\/em>14. FED-Konferenz (2006) Kassel
\nEine PDF-Datei erhalten Sie auf Anfrage.<\/a><\/i><\/p>\n

3. Aspects de conception en refroidissement \u00e9lectronique<\/strong><\/span><\/p>\n

Ralf Haermeyer, Andras Lelkes, Johannes Adam
\nK\u00fchlung elektronischer Systeme. 3.Temperatur- und Str\u00f6mungssimulation im Entwicklungsprozess: Einige Konstruktionsaspekte bei L\u00fcfterk\u00fchlung.<\/em><\/span> Tagungsband SPS\/IPC\/Drives 2004, 409-417 (2004)
\nTo download<\/a>
\n<\/i>
\nDr. Johannes Adam, Flomerics Limited
\nNumerische Thermo-Simulation. Konsistente thermische Vorab-Simulation von Leiterplatten und elektronischen Ger\u00e4ten. <\/em><\/span>DuV Kompendium 2004\/2005, 303-306 (2004). nicht mehr online.<\/p>\n

Dr. Johannes Adam, Flomerics Limited
\nPressure Drop Coefficients for Thin Perforated Plates<\/em><\/span>. <\/em>Electronics Cooling Magazine 4 (2), p. 40 (1998)
\n http:\/\/www.electronics-cooling.com\/articles\/1998\/may\/techbrief.php<\/a><\/i><\/p>\n

4. Temp\u00e9rature et temps<\/strong><\/span><\/p>\n

Dr. Johannes Adam (ADAM Research)
\nThermische Betrachtungen - Temperatur und Zeit<\/em><\/span>. 22. FED Konferenz (2014) Tagungsband, S. 276-284
\nMs zum download<\/a> <\/i><\/p>\n

Dr. Johannes Adam (ADAM Research)
\nVirtuelle Thermographie von Leiterplatten und Leiterbahnen. III. Zeitabh\u00e4ngigkeit.<\/em><\/span> PLUS 5 (2013) S. 970-973
\nScan zum download<\/a> <\/i>
\n <\/i><\/p>","protected":false},"excerpt":{"rendered":"

Cher lecteur, vous \u00eates le bienvenu pour prendre des informations pour votre travail professionnel. Soyez juste et respectez la pratique de la citation scientifique. Merci beaucoup! 1. Courant et temp\u00e9rature D. Brooks: PCB Trace and Via Currents and Temperatures: The Complete Analysis Finally! For the first time, here is a complete, thorough analysis of the ...continue reading \"Archive\"<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":36,"menu_order":6,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"\nArchive - ADAM Research<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"[:de]Archiv[:en]Archive[:fr]Archive[:es]Archivos[:] - ADAM Research\" \/>\n<meta property=\"og:description\" content=\"Cher lecteur, vous \u00eates le bienvenu pour prendre des informations pour votre travail professionnel. Soyez juste et respectez la pratique de la citation scientifique. Merci beaucoup! 1. Courant et temp\u00e9rature D. Brooks: PCB Trace and Via Currents and Temperatures: The Complete Analysis Finally! For the first time, here is a complete, thorough analysis of the ...continue reading "Archive"\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/\" \/>\n<meta property=\"og:site_name\" content=\"ADAM Research\" \/>\n<meta property=\"article:modified_time\" content=\"2019-10-31T09:52:45+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Dur\u00e9e de lecture estim\u00e9e\" \/>\n\t<meta name=\"twitter:data1\" content=\"13 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/\",\"url\":\"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/\",\"name\":\"[:de]Archiv[:en]Archive[:fr]Archive[:es]Archivos[:] - ADAM Research\",\"isPartOf\":{\"@id\":\"https:\/\/www.adam-research.de\/#website\"},\"datePublished\":\"2016-12-19T10:19:22+00:00\",\"dateModified\":\"2019-10-31T09:52:45+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Startseite\",\"item\":\"https:\/\/www.adam-research.de\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Dokumente\",\"item\":\"https:\/\/www.adam-research.de\/dokumente\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Archive\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.adam-research.de\/#website\",\"url\":\"https:\/\/www.adam-research.de\/\",\"name\":\"ADAM Research\",\"description\":\"Thermal Risk Management in Electronics\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.adam-research.de\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"fr-FR\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"[:de]Archiv[:en]Archive[:fr]Archive[:es]Archivos[:] - ADAM Research","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/","og_locale":"fr_FR","og_type":"article","og_title":"[:de]Archiv[:en]Archive[:fr]Archive[:es]Archivos[:] - ADAM Research","og_description":"Cher lecteur, vous \u00eates le bienvenu pour prendre des informations pour votre travail professionnel. Soyez juste et respectez la pratique de la citation scientifique. Merci beaucoup! 1. Courant et temp\u00e9rature D. Brooks: PCB Trace and Via Currents and Temperatures: The Complete Analysis Finally! For the first time, here is a complete, thorough analysis of the ...continue reading \"Archive\"","og_url":"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/","og_site_name":"ADAM Research","article_modified_time":"2019-10-31T09:52:45+00:00","twitter_card":"summary_large_image","twitter_misc":{"Dur\u00e9e de lecture estim\u00e9e":"13 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/","url":"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/","name":"[:de]Archiv[:en]Archive[:fr]Archive[:es]Archivos[:] - ADAM Research","isPartOf":{"@id":"https:\/\/www.adam-research.de\/#website"},"datePublished":"2016-12-19T10:19:22+00:00","dateModified":"2019-10-31T09:52:45+00:00","breadcrumb":{"@id":"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.adam-research.de\/en\/dokumente\/dokumentarchiv\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Startseite","item":"https:\/\/www.adam-research.de\/"},{"@type":"ListItem","position":2,"name":"Dokumente","item":"https:\/\/www.adam-research.de\/dokumente\/"},{"@type":"ListItem","position":3,"name":"Archive"}]},{"@type":"WebSite","@id":"https:\/\/www.adam-research.de\/#website","url":"https:\/\/www.adam-research.de\/","name":"ADAM Research","description":"Thermal Risk Management in Electronics","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.adam-research.de\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"fr-FR"}]}},"_links":{"self":[{"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/pages\/382"}],"collection":[{"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/comments?post=382"}],"version-history":[{"count":44,"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/pages\/382\/revisions"}],"predecessor-version":[{"id":1226,"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/pages\/382\/revisions\/1226"}],"up":[{"embeddable":true,"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/pages\/36"}],"wp:attachment":[{"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/media?parent=382"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}