{"id":414,"date":"2016-12-20T15:11:27","date_gmt":"2016-12-20T14:11:27","guid":{"rendered":"http:\/\/www.adam-research.de\/?page_id=414"},"modified":"2023-12-16T23:13:29","modified_gmt":"2023-12-16T22:13:29","slug":"english-recent-articles","status":"publish","type":"page","link":"https:\/\/www.adam-research.de\/fr\/dokumente\/english-recent-articles\/","title":{"rendered":"Articles"},"content":{"rendered":"

Douglas Brooks, Ph.D. (Ultracad Inc.),\u00a0 Johannes Adam (ADAM-Research) <\/strong>
\nHow many high-current vias do we need? (fewer than you think)<\/span><\/strong>
\nPrinted Circuit Design & Fabrication<\/a> 05 Dec 2023<\/p>\n

Doug Brooks<\/strong> s'exprime sur le th\u00e8me : \"Via et trace - Courant et temp\u00e9rature\".<\/span><\/strong>
\nPr\u00e9sentation vid\u00e9o<\/a> (2023)<\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.), Johannes Adam (ADAM-Research) <\/strong>
\nPCB Signal Traces Are Hotter Than We Think<\/em><\/span> Signal Integrity Journal (SIJ) (July 19, 2022) Link<\/a><\/i><\/span><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.)<\/strong>
\nThermal management: A close look at vertical heat flow in PCBs<\/em><\/span> Electronics Design News (EDN) (October 19, 2021) Link<\/a><\/i><\/span><\/p>\n

Johannes Adam (ADAM Research)<\/strong>
\nDon't believe the data sheets. <\/em><\/span>Design007 Magazine (September 2020) Link<\/a>
\n<\/span>
\nLe magazine complet avec les contributions de Doug Brooks (Vias) et Mike Jouppi (IPC-2221, IPC-2152) Link<\/a><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.), Johannes Adam (ADAM-Research) <\/strong>
\nCurrent Density: Interesting, But Irrelevant<\/em><\/span> Signal Integrity Journal (SIJ) (January 30, 2020) Link<\/a><\/i><\/span><\/p>\n

David Kalas; Karel Sima; Silvan Pretl; Jan Reboun; Radek Soukup; Ales Hamacek (Department of Materials and Technology, Faculty of Electrical Engineering, University of West Bohemia, Pilsen, Czech Republic)<\/strong>
\nTemperature Distribution Optimization for Multichannel Sensor System for Thermal Testing of Protective Gloves. <\/em><\/span>42nd International Spring Seminar on Electronics Technology (ISSE) (2019)
\nhttps:\/\/ieeexplore.ieee.org\/abstract\/document\/8810285<\/a><\/p>\n

Shusmitha Kyatam, Pedro Camacho, Lu\u00eds Rodrigues, Lu\u00eds Nero Alves, Joana Catarina Mendes (Instituto de Telecomunica\u00e7\u00f5es, Campus Universit\u00e1rio de Santiago, Aveiro, Portugal)<\/strong>
\nThermal analysis of high power LEDs using different PCB materials<\/span>. <\/a><\/em>European Conference on Circuit Theory and Design (ECCTD) (2017) <\/a>https:\/\/ieeexplore.ieee.org\/abstract\/document\/8093259<\/a><\/p>\n

Johannes Adam (ADAM Research)
\n<\/strong>Feature interview Dr. Johannes Adam Sounds the Alarm for Thermal Design<\/span><\/em> by Andy Shaughnessy I-CONNECT007. The PCB Design Magazine (pp 16. December 2017). <\/span>
\nLink<\/a><\/i><\/span><\/p>\n

Toute la interview: http:\/\/iconnect007.uberflip.com\/i\/916068-pcbd-dec2017<\/a>
\nPlus: pcb-magazine<\/a>, pcb-design-magazine<\/a>,smt-magazine<\/a> ,iconnect007<\/a><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.)
\n<\/strong>Feature interview<\/span> Thermal Management Update with Douglas Brooks<\/span>.<\/em>by Andy Shaughnessy I-CONNECT007. The PCB Design Magazine (pp 22. December 2017). <\/span>
\nLink<\/a> <\/i><\/span><\/span><\/p>\n

Nitesh Kumar Sardana (Robert Bosch Engineering & Business Solution (RBEI))
\n<\/strong>Simulation Driven Design Optimization for Reduction of Temperature on a High Current Density PCB. <\/em><\/span>Electronics Cooling<\/a> (July 27, 2017). <\/span> <\/span><\/p>\n

Johannes Adam (ADAM Research)<\/strong>
\nSimulated and Experimental Temperature. <\/em><\/span>Essais et simulation<\/a> (No 127. pp 38. Janvier-Fevrier 2017). <\/span> <\/span>
\nLes caract\u00e9ristiques thermiques de composants \u00e9lectroniques sont publi\u00e9es, cependant pour les cartes \u00e9lectroniques ce n\u2019est pas souvent le cas. Le logiciel TRM permet de cr\u00e9er un mod\u00e8le thermique \u00e0 partir des donn\u00e9es de conception et de fabrication d\u2019une carte \u00e9lectronique, dans son environnement (position, temp\u00e9rature, ventilation\u2026). ... . Link<\/a><\/p>\n

Johannes Adam, Christian Tichet (EDA Expert srl)<\/strong>
\nInt\u00e9r\u00eat et pr\u00e9cision de la simulation thermique sur une carte \u00e9lectronique. <\/span><\/em>Les cahiers de l\u2019industrie \u00e9lectronique et num\u00e9rique (mars 2017, No. 91, pp. 40-41).<\/span><\/span>
\nLink<\/a><\/span>
\n<\/span><\/em><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.)<\/strong>
\nExiting New Technology: Thermal Risk Maganagament. <\/span><\/em>The PCB Design Magazine (Feb 2017).<\/span><\/span>
\nLink<\/a><\/p>\n

Douglas Brooks (Ultracad Inc.), Ph.D., Norocel Codreanu, Ph.D. (Polytechnic Univ Bucuresti, UPB), and Dr. Johannes Adam<\/strong>
\nThermal Effects around Right-Angle Trace Corners<\/i><\/span> . <\/i><\/span>Printed Circuit Design and Fabrication (2017).
\nLink<\/a><\/p>\n

Hansang Lim, Do-Hwan Jung, Jun Seo Park (Department of Electronics Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea)<\/strong>
\nDownsizing an automotive junction box based on large current-carrying printed-circuit board optimization. <\/em><\/span>Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering Volume 231, Issue 2\u00a0 (2019) https:\/\/doi.org\/10.1177\/095440701665749<\/a><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.)<\/strong>
\nYour Traces have Hot Spots<\/i>.<\/span> The PCB Design Magazine (2016)
\nLink<\/a> <\/i><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.)<\/strong>
\nEmpirical Results of Fusing Tests<\/i>.<\/span> Printed Circuit Design and Fabrication (2015)
\nLink<\/a> <\/i><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.) and Dr. Johannes Adam (ADAM Research)<\/strong>
\nThe Dynamics of PCB Trace Heating and Cooling, and a Call to Action<\/i><\/span>. PCD&F July (2016)
\nLink<\/a> <\/i><\/p>\n

Douglas Brooks, Ph.D. (Ultracad Inc.) and Dr. Johannes Adam (ADAM Research)<\/strong>
\nTrace Current\/Temperature Relationships<\/span>.<\/i> PCD&F June (2015) Vol. 32 No.6, pp. 22-27
\nLink<\/a><\/i><\/p>\n

Mike Jouppi (Thermal Managament LLC)<\/strong>
\nTechnology Specific, Current Carrying Capacity Design Charts. An Extension of IPC\u20102152. <\/em>Advancements in Thermal Management 2015 <\/span><\/span>Link<\/a><\/p>\n

Dr. Johannes Adam (ADAM Research)<\/strong>
\nThermal Management of Boards and Current-Carrying Capacity. <\/span><\/em>Bodo's Power System, Issue October (2011), pp. 40
\nLink<\/a><\/i><\/p>","protected":false},"excerpt":{"rendered":"

Douglas Brooks, Ph.D. (Ultracad Inc.),\u00a0 Johannes Adam (ADAM-Research) How many high-current vias do we need? (fewer than you think) Printed Circuit Design & Fabrication 05 Dec 2023 Doug Brooks s'exprime sur le th\u00e8me : \"Via et trace - Courant et temp\u00e9rature\". Pr\u00e9sentation vid\u00e9o (2023) Douglas Brooks, Ph.D. (Ultracad Inc.), Johannes Adam (ADAM-Research) PCB Signal Traces ...continue reading \"Articles\"<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":36,"menu_order":4,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"\nArticles - ADAM Research<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"[:de]Neuere Artikel[:en]Recent Articles[:fr]Articles [:] - ADAM Research\" \/>\n<meta property=\"og:description\" content=\"Douglas Brooks, Ph.D. (Ultracad Inc.),\u00a0 Johannes Adam (ADAM-Research) How many high-current vias do we need? (fewer than you think) Printed Circuit Design & Fabrication 05 Dec 2023 Doug Brooks s'exprime sur le th\u00e8me : "Via et trace - Courant et temp\u00e9rature". Pr\u00e9sentation vid\u00e9o (2023) Douglas Brooks, Ph.D. (Ultracad Inc.), Johannes Adam (ADAM-Research) PCB Signal Traces ...continue reading "Articles"\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/\" \/>\n<meta property=\"og:site_name\" content=\"ADAM Research\" \/>\n<meta property=\"article:modified_time\" content=\"2023-12-16T22:13:29+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Dur\u00e9e de lecture estim\u00e9e\" \/>\n\t<meta name=\"twitter:data1\" content=\"4 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/\",\"url\":\"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/\",\"name\":\"[:de]Neuere Artikel[:en]Recent Articles[:fr]Articles [:] - ADAM Research\",\"isPartOf\":{\"@id\":\"https:\/\/www.adam-research.de\/#website\"},\"datePublished\":\"2016-12-20T14:11:27+00:00\",\"dateModified\":\"2023-12-16T22:13:29+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Startseite\",\"item\":\"https:\/\/www.adam-research.de\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Dokumente\",\"item\":\"https:\/\/www.adam-research.de\/dokumente\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Neuere Artikel\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.adam-research.de\/#website\",\"url\":\"https:\/\/www.adam-research.de\/\",\"name\":\"ADAM Research\",\"description\":\"Thermal Risk Management in Electronics\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.adam-research.de\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"fr-FR\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"[:de]Neuere Artikel[:en]Recent Articles[:fr]Articles [:] - ADAM Research","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/","og_locale":"fr_FR","og_type":"article","og_title":"[:de]Neuere Artikel[:en]Recent Articles[:fr]Articles [:] - ADAM Research","og_description":"Douglas Brooks, Ph.D. (Ultracad Inc.),\u00a0 Johannes Adam (ADAM-Research) How many high-current vias do we need? (fewer than you think) Printed Circuit Design & Fabrication 05 Dec 2023 Doug Brooks s'exprime sur le th\u00e8me : \"Via et trace - Courant et temp\u00e9rature\". Pr\u00e9sentation vid\u00e9o (2023) Douglas Brooks, Ph.D. (Ultracad Inc.), Johannes Adam (ADAM-Research) PCB Signal Traces ...continue reading \"Articles\"","og_url":"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/","og_site_name":"ADAM Research","article_modified_time":"2023-12-16T22:13:29+00:00","twitter_card":"summary_large_image","twitter_misc":{"Dur\u00e9e de lecture estim\u00e9e":"4 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/","url":"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/","name":"[:de]Neuere Artikel[:en]Recent Articles[:fr]Articles [:] - ADAM Research","isPartOf":{"@id":"https:\/\/www.adam-research.de\/#website"},"datePublished":"2016-12-20T14:11:27+00:00","dateModified":"2023-12-16T22:13:29+00:00","breadcrumb":{"@id":"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.adam-research.de\/dokumente\/english-recent-articles\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Startseite","item":"https:\/\/www.adam-research.de\/"},{"@type":"ListItem","position":2,"name":"Dokumente","item":"https:\/\/www.adam-research.de\/dokumente\/"},{"@type":"ListItem","position":3,"name":"Neuere Artikel"}]},{"@type":"WebSite","@id":"https:\/\/www.adam-research.de\/#website","url":"https:\/\/www.adam-research.de\/","name":"ADAM Research","description":"Thermal Risk Management in Electronics","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.adam-research.de\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"fr-FR"}]}},"_links":{"self":[{"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/pages\/414"}],"collection":[{"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/comments?post=414"}],"version-history":[{"count":103,"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/pages\/414\/revisions"}],"predecessor-version":[{"id":1958,"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/pages\/414\/revisions\/1958"}],"up":[{"embeddable":true,"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/pages\/36"}],"wp:attachment":[{"href":"https:\/\/www.adam-research.de\/fr\/wp-json\/wp\/v2\/media?parent=414"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}