Fallstudien (EN)

#1 Johannes Adam (ADAM Research) and Mike Jouppi (Thermal Management LLC)
Simulated and Experimental Component Temperature on the Intersil ISL8240 Evaluation Board. Case Study No. 1 (2015)

#2 Johannes Adam (ADAM Research) and Douglas Brooks (UltraCAD Inc.)
Electric Current and VIA Temperature - Experiment vs. Simulation. Case Study No. 2 (2016)

#3 Jeffrey Gorissen (PXL University College ,Hasselt, Belgium)
Efficient PCB Production by thermal Simulation. Bachelor project academic year 2018-2019.

#4 Johannes Adam (ADAM Research)
Faster Electrical and Thermal Simulation using the Example of a Heating Loop. Case Study No. 4 (EN, 2019)
Schnellere Elektrische und Thermische Simulation am Beispiel einer Heizfolie. Case Study No. 4 (DE, 2019)