Author: admin
Release TRM3.10
TRM3.10 is available.
Highlights:
Interface Pulsonix 14 <-> TRM
- PSX: Define attributes as watts, amps, volts (optional)
- PSX: Automatic transfer of all layers, prepregs, drill holes (through, blind, buried), pins (netlist), components and attributes to TRM

- TRM: Import (wizard) automatically creates a board model ready for calculation
- PSX: Import of results for visualisation in design (optional)

Altium Interface
- Electric assignment to pins now also available in Parameter Manager

Zuken
- eCADSTAR interface. Simplification of buttons and installation

- CR-5000/CR-8000. Netlist
Circuit simulation
- Resumption from TRM2
- Define currents in sections of time or phase with MS-Excel and calculate the load integral, e.g. for one period
Calculation
- Simpler import of non-rectangular board contour and cutouts
- Transient ambient temperature
Ask for a trial period: Request Form
Interfaces Pulsonix <-> TRM

WestDev (UK) and ADAM Research offer interfaces between Pulsonix V14 and TRM3.10. This gives Pulsonix users easy access to thermo-electrical simulations of their PCB assemblies
- Export of design and attributes from Pulsonix
- Import and calculation in TRM
- Visualization of results in Pulsonix
New White Paper about Infineon CoolSiC Evaluation Board
Infineon CoolSiC (EN)

Now online: Interface Zuken eCADSTAR -> TRM3
TRM3 - add it to ZUKEN eCADSTAR

Currents heat up a printed board assembly in the components and conductor traces. TRM is the simulation software for a detailed check of the expected temperature (currents, component heating, cooling to the environment, etc.), allowing you to calculate the thermal risks of your PCB before laboratory testing.
Transfer design data from eCADSTAR von ZUKEN.
All necessary information can be found here: CSK (all languages)
The TRM tool should therefore be regarded as a power distribution network (PDN) plus thermal analysis tool performing 3D temperature calculations for you. To ensure that this process is as secure and user-friendly as possible eCADSTAR is intefaced with TRM. CSK has created scripts so that users can export all relevant design data from eCADSTAR into the TRM software with a single click, allowing the thermal simulation to be started.
This makes TRM well suited for beginners.
Experts will find many interesting options for advanced situations.
TRM result and Experiment
A new study focuses on the EVAL-LTM4703-AZ evaluation board, a high-efficiency, dual-channel μModule® regulator capable of delivering up to 12A.
Detailed study about a PCB with switching regulator
The compact design and high-power density of this regulator make it an ideal candidate for analyzing thermal challenges in switching regulators. By bridging theoretical modeling, experimental validation, and simulation, this work comprehensively assesses temperature rise and associated phenomena. Methods to calculate power losses, measure thermal profiles under operational stress, and simulate heat distribution using TRM software are presented.
TRM3.9 Released
- Export and Import from Zuken eCADSTAR . A new Wizard!
- From schematics
- From Constraint Browser

- Altium Wizard. Extended TRM parameter by Amp/Volt and Ohm for Components
- From schematics
- From Parameter Manager

- Laods
Prefix for Ohm , like 3mR or 10kR - Test it
Table for power factor (derating) of components
Thermal Simulation with TRM3 and ZUKEN e-CADSTAR
NEW! Interfaces for ZUKEN eCADSTAR 2024 and TRM3
- Export all relevant design files (+ extras) from e-CADSTAR at the touch of a button
- Assign thermally relevant parameters (Watts, Amperes, Rth, ...) in schematic or in Constraint Manager of e-CADSTAR
- Import all data and model setup in TRM3 via 1-button wizard
- Lots of freedom in modifying the layer structure and other values and parameters in TRM3
- More about: Zuken eCADSTAR website
Test it yourself. Just ask your ZUKEN reseller, CSK or ADAM-Research for licenses and test installation. Or contact your local Zuken office or reseller.



Thermal interaction of a shunt resistor and the traces
In Bodo’s Power Magazine ist mir in einem Beitrag von ROHM’s Trevis Moench sofort ein Bild aufgefallen welches einen Widerstand in breitseitigem und in schmalseitigem Anschluss an die Leiterbahnen zeigt. Wieviel bringt das Drehen des Widerstands für das Thermal Management wirklich für die Temperatur und was ist der Beitrag der Leiterbahn? Darüber wird in einem neuen WhitePaper #14 aufgeklärt. Ich habe gestaunt.

How effective are thermal vias?
New White Paper #13: "How effective are thermal vias? Less than you think"
